SI-66AK2xxDSP
SI-66AK2xx Board
A powerful Keystone II Multicore ARM + Digital Signal Processor (DSP) card for the PCIe bus.

Description

The SI-66AK2xxDSP from Sheldon Instruments is a C programmable ARM plus Digital Signal Processor (DSP) card designed for low power environments that require intensive computing in a cost sensitive solution.

Keystone II devices supported on the SI-66AK2xxDSP card:
66AK2H14 (4 ARM + 8 DSP CorePacs)
66AK2H12 (4 ARM + 8 DSP CorePacs)
66AK2H06 (2 ARM + 4 DSP CorePacs)
66AK2L06 (2 ARM + 4 DSP CorePacs)

The 66AK2xDSP-PCIe is a Small Form Factor (SFF) family of Commercial Off the Shelf (COTS) cards featuring the powerful Keystone II 66AK2xx ARM plus DSPs from Texas Instruments. The TI 66AK2xx devices are multicore ARM + DSP System on Chip (SoC), conveniently programmed using the C language. There are separate ARM and DSP subsections, with the ARM subsection consisting of two to four A15 cores clocked at 1.4GHz for a maximum of 192,000 MIPS, and with the DSP subsection consisting of four to eight C667x CorePacs clocked at 1.2GHz for a maximum of 352 GMAC performance. All of this is attained at a mere 14 watts of power consumption while most processors of this caliber are in the 60W range.

The ARM subsection features 32K Bytes of L1 per core and 4M Bytes of shared L2 on internal memory. Each CorePac of the DSP subsection features 32K Bytes L1P, 32K Bytes L1D, and 1M Bytes of L2. Each level of cache can be programmed in blocks as SRAM or cache. The 66AK2xx chip also features a memory controller that arbitrates 6M Bytes of shared SRAM memory between all cores of both subsections, along two external 64-bit DDR3 memory interfaces at 1600MHz.

High Speed Serial Interfaces: GbE, PCIe, & SRIO
There are multiple high speed interfaces, with each capable of moving large amounts of data. The Gigabit Ethernet interface can take advantage of the on-chip Network Co-processor to offload most of the packet processing, thereby enabling full bandwidth utilization and freeing up the ARM+DSPs to perform the computations for which they were designed. A PCIe x2 Gen 2.0 interface provides connectivity to a system backplane or Thunderbolt cable, and the flexible SRIO 2.1 x4 5Gbps interface can be connected to either an optional FPGA or other external peripherals. Separately, the 66AK2H14 also features a 10 Gigabit Ethernet switch subsystem.

Hardware Expansion with FPGA & FMC
The optional Altera Cyclone V FPGA includes SI’s proprietary IP layer that transparently translates SRIO so the FPGA may be used as an extra processing resource, as well as an expansion bridge to either an FPGA Mezzanine Card (FMC), or a legacy style parallel expansion bus – ideal for those who prefer to leverage a wide array of 3rd party FMC modules, their own custom hardware or simply update legacy designs with minimal effort.

Options
Upgrade options for the SI-66AK2xxDSP include various core and memory configurations, nonvolatile storage, and either commercial or expanded temperature ranges. A full line of software development tools are available from Sheldon Instruments and TI for Windows and Linux platforms.

Applications

  • Real Time Image Processing
  • Machine Vision
  • Unmanned Aerial Vehicle Control Systems
  • Industrial Control and Automation
  • Additive Manufacturing
  • Medical Imaging
  • Military and Aerospace
  • Test and Measurement


Block Diagram

PCIe-104 Diagrams


The SI-66AKH2xDSP is available with extensive development tools from Sheldon Instruments and TI for both the host PC side as well as the DSP side.

Host Side Tools
For the host PC side, Sheldon Instruments provides Windows/Linux 32/64 bit drivers, along with comprehensive sample application projects, with easy to use API libraries and related source code. The sample projects will be supplied as a command line utility, with a companion Qt GUI version. Its functionality includes:

  • Load ELF/EABI files created from TI’s Code Composer Studio (CCS) to any one of the user specified cores, and also enable the core to execute its program.
  • Comprehensive communications with read and write functionality to demonstrate single register, a register array, and DMA accesses.
  • A messaging scheme will be implemented allowing for either the host PC or the DSP to alert the other for user defined asynchronous events.

DSP Side Tools
For the DSP side, TI tools include Code Composer Studio Integrated Development Environment (CCS), and the Multicore Software Development Kit (MCSDK) that includes the Board Support Package (BSP), Chip Support Library (CSL), Network Development Kit (NDK), and Sys/Bios. Sheldon Instruments provides various TI CCS projects for the DSP, both compiled versions for quick loading with the host side sample program, along with complete projects and related source code. These DSP projects include:

  • A bare low-level runtime initializer to demonstrate how to setup DSP entry points.
  • A project to demonstrate TI SYS/Bios usage and initialization.
  • Various projects to demonstrate initialization and usage of the C667x system components. In particular, configuration of the DDR3 module, Ethernet (with a stack or using the packet accelerator), EDMA3 transfers, and the Onchip Interrupt Controller.

Keystone II 66AKH2x Processor Resources
For more detailed software documentation, check out the SI-C667x Keystone I Wiki Homepage.

There is important information for developers available from Texas Instrument’s website.


Processor for SI-66AK2xxDSP

TI Keystone II 66AK2xx Family
Number of Cores 66AK2H06 and 66AK2L06 2 ARM + 4 DSP
66AK2H12 and 66AK2H14 4 ARM + 8 DSP
DSP Subsection (each C667x CorePac) Clocking 1.2GHz
GMACS/GFLOPS 38.4/19.2
L1 Program Cache/SRAM 32KB
L1 Data Cache/SRAM 32KB
L2 Cache/SRAM 1MB
ARM Subsection (each Cortex A15 core) Clocking 1.4GHz
MIPS 9800
L1 Instruction and Data Cache/SRAM 32KB
Shared L2 Cache/SRAM 4MB
Shared L2 Cache/SRAM 6MB

 


External Memory

DDR3 Memory
Port A Size 2GB (256M x 64)
Speed 1600Mhz
Port B (66AK2Hxx only) Size 2GB (256M x 64)
Speed 1600Mhz

 

Storage / Nonvolatile Memory
SPI up to 64Mbit (8Mbx8) Flash
microSD flash card
I2C up to 2KB EEPROM (inside Tiva uC)

 


Optional Altera Cyclone 5 GX FPGA

Resource C3 C4 C5 C7 C9
Logic Elements (LE) (K) 31.5 50 77 149.5 301
ALM 11900 18868 29080 56480 113560
Register 47600 75472 116320 225920 454240
M10K 1190 2500 4460 6860 12200
MLAB 159 295 424 836 1717
Variable-preicision DSP Block 51 70 150 156 342
18 x 18 Multiplier 102 140 300 312 684
PLL 4 6 6 7 8
SRIO Lanes @ 3.125Gbps 2 4 4 4 4

 

Other Altera, Xilinx or Lattice devices also available on special request.

High Performance Serial Interfaces

Interface Lanes Speed
PCI Express Gen2 Desktop PCIe: 2 5 Gbps
PCIe-104: 1 or 2
Thunderbolt: 2
SRIO rev2.1 (66AK2Hxx only) 4 5 Gbps
Gigabit Ethernet 1 10/100/1000 Mbps
10 Gigabit Ethernet (66AK2H14 only) 1 10 Gbps
Hyperlink (66AK2Hxx only) 4 12.5 Gbps

 


Connectors

Port Connectors
DSP Ports (all form factors) PCIe Gen 2 Desktop PCIe: One Edge connector (Endpoint)
PCIe-104: One 3 segment Samtec QMS (Root Complex or Endpoint)
Ethernet Two RJ45s with integrated magnetics and LED indicators
microSD One standard socket for microSD/SPI flash
JTAG One keyed 14 pin (2×7) header; compatible with all third party emulators and debuggers
Optional Hyperlink (66AK2Hxx only) Desktop PCIe: One mini-SAS HD+ 4i socket connector; Molex part number 76867-001; Mating cable is Molex 1110670200
PCIe-104: One Searay connector to stack another SI-DSP carrier also equipped with a Hyperlink port.
DSP Ports (Desktop PCIe only) Optional RS-232 UART One 10 pin (2×5) header
Tiva uC USB One microAB for card configuration

 

Optional Peripheral Expansion
SRIO x1 lane Expansion (66AK2Hxx only) Single segment QMS connector
FMC/Parallel Expansion (available with FPGA only) FMC connector

 


Mechanical Properties

Physical Dimensions/Electrical Requirements/Temperature
Form Factor Dimensions Desktop PCIe (3/4 size): 9″/23cm(L) x 4.9″/12.5cm(W)
PCIe-104: 4.55″/11.6cm(L) x 3.775″/9.59cm(W)
Weight 0.31lbs/140 grams
Supply Voltages 3.3V @ 0.75A and +12V @ 1.5A
Power 20 Watts typical; up to 28W with optional FPGA
Temperature Commercial grade 0-85C. Consult factory for availability of industrial and military temperature grades

 


PCIe Form Factor Cards

Product Description Price (US dollars)
SI-66AK2H14DSP-PCIe 66AK2H14 – 4 ARM + 8 DSP CorePacs Call
SI-66AK2H12DSP-PCIe 66AK2H12 – 4 ARM + 8 DSP CorePacs Call
SI-66AK2H06DSP-PCIe 66AK2H06 – 2 ARM + 4 DSP CorePacs Call
SI-66AK2L06DSP-PCIe 66AK2L06 – 2 ARM + 4 DSP CorePacs Call

 

PCIe-104 Form Factor Cards

Product Description Price (US dollars)
SI-66AK2H14DSP-PCIe 66AK2H14 – 4 ARM + 8 DSP CorePacs Call
SI-66AK2H12DSP-PCIe 66AK2H12 – 4 ARM + 8 DSP CorePacs Call
SI-66AK2H06DSP-PCIe 66AK2H06 – 2 ARM + 4 DSP CorePacs Call
SI-66AK2L06DSP-PCIe 66AK2L06 – 2 ARM + 4 DSP CorePacs Call

 

FPGA Options

Product Description Price (US dollars)
-C3 x2 SRIO @ 3.125Gbps – 31k Gates Call
-C4 x4 SRIO @ 3.125Gbps – 50k Gates Call
-C5 x4 SRIO @ 3.125Gbps – 77k Gates Call
-C7 x4 SRIO @ 3.125Gbps – 149k Gates Call
-C9 x4 SRIO @ 3.125Gbps – 301k Gates Call